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| EMIF10-COM01C2 IPADTM EMI Filter including ESD protection Main product characteristics EMI filtering and ESD protection for: Computers and printers Communication systems Mobile phones Lead free coated Flip-Chip (25 Bumps) Description The EMIF10-COM01C2 is a highly integrated device designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV. Order code Part Number EMIF10-COM01C2 Marking FE Figure 1. Pin configuration (Bump side) 5 I5 Benefits 4 I4 3 I3 2 I2 1 I1 EMI symmetrical (I/O) low-pass filter Coating resin on flat side Very low PCB space consuming: < 6 Very thin package: 0.65 mm High efficiency in ESD suppression on both input and output pins High reliability offered by monolithic integration Lead free package Figure 2. Basic cell configuration Low-pass Filter I10 I9 I8 I7 I6 A B C D E mm2 GND GND GND GND GND 010 09 08 07 06 05 04 03 02 01 Complies with the following standards: IEC 61000-4-2 level 4 15 kV (air discharge) 8 kV (contact discharge) Input Output TM: IPAD is a trademark of STMicroelctronics RI/O = 200 Cline = 45 pF April 2006 Rev4 1/7 www.st.com 7 Characteristics EMIF10-COM01C2 1 Characteristics Table 1. Symbol VPP Tj Top Tstg Absolute Ratings (Tamb = 25 C) Parameter and test conditions ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge Junction temperature Operating temperature range Storage temperature range Value 15 8 125 - 40 to + 85 - 55 to + 150 Unit kV C C C Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM Rd RI/O Cline tLH Electrical Characteristics (Tamb = 25 C) Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Resistance between Input and Output Input capacitance per line slope : 1 / R d IPP VCL VBR VRM IRM IR I V Test conditions IR = 1 mA VRM = 3 V per line IPP = 10 A, tp = 2.5 s Min. 6 Typ. 8 Max. 10 500 Unit V nA 1 180 200 45 220 50 25 pF ns At 0 V bias Vinput = 2.8 V Rload = 100 k 2/7 EMIF10-COM01C2 Characteristics Figure 3. 0.00 dB -10.00 -20.00 S21(db) attenuation measurement(1) Figure 4. 0.00 dB -10.00 Analog crosstalk -20.00 -30.00 -40.00 -50.00 -30.00 -40.00 -50.00 100.0k 1.0M 10.0M 100.0M f/Hz 1.0G -60.00 -70.00 -80.00 -90.00 -100.00 100.0k 1.0M Xtalk 1/2 448 10.0M f/Hz 100.0M Xtalk 1/2 342 1.0G 1. Spikes at high frequencies are induced by the PCB layout Figure 5. ESD response to IEC 61000-4-2 Figure 6. (+15 kV air discharge) on one input (Vin) and on one output (Vout) ESD response to IEC 61000-4-2 (-15 kV air discharge) on one input (Vin) and on one output (Vout) V(in1) V(in1) V(out1) V(out1) Figure 7. Rise time measurement EMIF10-COM01C2 In Out Vout Square signal Generator Vc = 2.8V Vin 100k Vout Vin 3/7 Characteristics EMIF10-COM01C2 Figure 8. C(pF) 50 Capacitance versus reverse applied voltage F=1MHz Vosc=30mV 40 30 20 10 0 1 2 VR(V) 3 4 5 Figure 9. in Aplac model 200R out MODEL = demif10 MODEL = demif10 Demif10 model BV = 7 IBV = 1m CJO = 25p M = 0.3333 RS = 1 VJ = 0.6 TT = 100n sub 1.1 PCB grounding recommendations In order to ensure a good efficiency in terms of ESD protection and filtering behavior, we recommend to implement microvias (100 m dia.) between the GND bumps and the GND layer. GND bumps can be connected together in PCB layer 1, and in addition, if possible, use through hole vias (200 m dia.) in both sides of filter to improve contact to GND (layer). This layout will minimize the distance to the ground and thus parasitic inductances. In addition, we recommend to have GND plane wherever possible. 4/7 EMIF10-COM01C2 Ordering Information Scheme 2 Ordering Information Scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package C = coated flip-chip x = 1: 500m, Bump = 315m = 2: Leadfree Pitch = 500m, Bump = 315m yy - xxx zz Cx 3 Package information Figure 10. Flip-Chip package dimensions 500 m 50 315 m 50 500 m 50 695 m 70 2.42 mm 50 m Figure 11. Foot print recommendations Figure 12. Marking 2.42 mm 50 m Copper pad Diameter: 250 m recommended, 300 m max Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) E Solder stencil opening: 330 m Solder mask opening recommendation: 340 m min for 300 m copper pad diameter xxz y ww 5/7 Ordering information Figure 13. Flip-Chip tape and reel specification Dot identifying Pin A1 location 4 +/- 0.1 O 1.5 +/- 0.1 EMIF10-COM01C2 1.75 +/- 0.1 3.5 +/- 0.1 0.73 +/- 0.05 All dimensions in mm In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Note: More informations are available in the application notes: AN1235: "Flip-Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" 8 +/- 0.3 STE STE STE xxz yww User direction of unreeling xxz yww xxz yww 4 +/- 0.1 4 Ordering information Ordering code EMIF10-COM01C2 Marking FE Package Flip-Chip Weight 8.3 mg Base qty 5000 Delivery mode Tape and reel 5 Revision history Date 12-Jul-2005 12-Aug-2005 27-Jan-2006 04-Apr-2006 Revision 1 2 3 4 First issue. Lead free added in Benefits on page 1. ECOPACK statement added on page 6. Improved graphics to show coating. Updated attenuation measurement graphic (Figure 3). Weight corrected. Reformatted to current standard. Pin identification in Figure 1 updated. Description of Changes 6/7 EMIF10-COM01C2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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